Astacian Bogdon: Project Engineer I in Anaheim, CA

Led a multi-disciplinary engineering development of complex PCB communication systems in correspondence with internal and military standards. Responsible for maintaining high quality mechanical drawings and electrical schematics for customer submittals and organize preliminary/critical design reviews for in-process designs. Created new tools and reports to clearly communicate resource demand, supply, gaps, and corrective actions to senior management that decreased over and under allocated resources by twenty-five percent. Created and implemented the process for configuration controlling IBM DOORS requirement modules.

Solved product-specific failure criteria of radio frequency (RF) components by performing steady state or transient heat transfer analyses. Performed trade studies on multiple RF components using finite element analysis for analyzing thermal properties of components with varying and researched heatsink materials, or QFN package selections. Performed thermal and static analyses on more than ten electronic packages for testing by simulation. Mechanically designed hardware (housing/radome) for a digital beam forming antenna in military standard GD&T for proper form, fit, and function.